Step#1 Film Generation:

Generated from your *.xpc file we create and exact film representation of your design. We will create one film per layer.

Step#2 Shear Raw Material:

Industry standard 0.059" thick, copper clad, two sides. Panels will be sheared to accommodate many boards.

Step#3 Drill Holes:

Using NC machines and carbide drills.

Step#4 Electroless Copper:

Apply thin copper deposit in hole barrels.

Step#5 Apply Image:

Apply photosensitive dryfilm (plate resist) to panel. Use light source and film to expose panel. Develop selected areas from panel.

Step#6 Pattern Plate:

Electrochemical process to build copper in the holes and on the trace area. Apply tin to surface.

Step#7 Strip & Etch:

Remove dryfilm, then etch exposed copper. The tin protects the copper circuitry from being etched.

Step#8 Solder mask:

Apply solder mask area to entire board with the exception of solder pads.

Step#9 Solder coat:

Apply solder to pads by immersing into tank of solder. Hot air knives level the solder when removed from the tank.

Step#10 Nomenclature:

Apply white letter marking using screen printing process

Step#11 Fabrication:

Route the perimeter of the board using NC equipment